Agglomeration of Silicon Dioxide Nanoscale Colloids in Chemical Mechanical Polishing Wastewater: Influence of pH and Coagulant Concentration
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چکیده
منابع مشابه
Controlled chemical mechanical polishing of polysilicon and silicon dioxide for single-electron device
In this article, the authors report experimental results of the chemical mechanical polishing CMP of silicon dioxide SiO2 and polysilicon to produce nanoscale features with very smooth surfaces. The sizes of the features polished ranged from 30 to 500 nm. For polysilicon polishing, the nanostructures were defined in positive tone e-beam resist and the pattern was transferred to the oxide substr...
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since the 1960s the age effects on learning both first and second language have been explored by many linguists and applied linguists (e.g lennerberg, 1967; schachter, 1996; long, 1990) and the existence of critical period for language acquisition was found to be a common ground of all these studies. in spite of some common findings, some issues about the impacts of age on acquiring a second or...
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ژورنال
عنوان ژورنال: Civil and Environmental Engineering Reports
سال: 2019
ISSN: 2450-8594,2080-5187
DOI: 10.2478/ceer-2019-0040